The compact IP67 fieldbus I/O modules from our technology partner Turck are available with the fieldbus protocols PROFIBUS-DP, EtherCAT, Modbus TCP, EtherNet/IP and PROFINET. They are fully encapsulated, vibration and shock tested and have glass-fibre reinforced plastic housings and metal connectors. This makes the modules ideally suited for use in harsh industrial environments and with the large temperature range of -40...+70 °C they can also withstand outdoor applications without any problems.
The integrated web server makes it particularly easy to integrate the devices. The IO-Link master modules in particular offer special convenience with the web-based IO-Link device configuration and direct access from the engineering tool, e.g. TIA Portal or CODESYS, with the Simple IO-Link Device Integration configuration (SIDI).
Via Field Logic Control ARGEE (FLC), the devices can be programmed via a HTML5-capable browser and thus support decentralized approaches or even enable small stand-alone systems.
Since certain controllers are limited in the number of IP addresses, the Backplane Ethernet Extension Protocol (BEEP) is particularly useful, because it allows up to 33 I/O modules to be operated at one IP address.
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